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Semiconductor inspection equipment: CNC machining of probe station parts -KANOU

Semiconductor inspection equipment: CNC machining of probe station parts -KANOU

Semiconductor Probe Station1

Semiconductor testing equipment is equipment specifically designed to evaluate the performance and quality of semiconductor materials, devices and integrated circuits (ICs). These devices use a variety of advanced technologies and methods to provide accurate and reliable measurement and analysis capabilities to ensure that semiconductor products meet high standard performance requirements.

Common semiconductor testing equipment includes parameter analyzers, probe stations, scanning electron microscopes (SEM), energy dispersive analyzers (EDX), thermal analyzers, radio frequency test instruments, etc. These devices are widely used to aid engineering in semiconductor R&D, production and quality control processes. Below we mainly talk about the manufacturing of the probe station.

The core components of the probe station:

The core components of the probe station mainly include several aspects: mechanical mechanism (fixing and positioning the probe and the product to be tested), probe card holder (installing and connecting the test probe part, micro probe, and needle tip), and micro-motion platform (providing position adjustment), the adjustment mechanism of the probe holder, the temperature control system, and the optical imaging system (providing observation for personnel).

Semiconductor Probe Station

CNC machining process of probe station parts:

The main parts of the probe station are processed using a series of CNC machining methods, and a small number of parts require EDM and injection molding. We mainly talk about CNC here. The CNC processes that need to be used when manufacturing probe station parts are mainly precision milling, turning, drilling and grinding, and thread processing. I have compiled the detailed process into a table for easy understanding.

1. Design stage:

Based on product design drawings and specifications, CAD (computer-aided design) software is used to create three-dimensional models of components.

Write CNC machining programs, including parameters such as cutting path, tool selection, cutting speed, feed speed and cutting depth.

2. Material preparation:

Select the appropriate metal material, such as aluminum, stainless steel or titanium, and cut it to the required size according to the design requirements.

Clean and remove oxides and oil from the material surface to facilitate subsequent processing.

3.CNC milling:

Use CNC milling machines for profile cutting and hole machining.

According to the preset CNC program, the movement of the milling cutter is automatically controlled to form the required contours, holes and grooves in the material.

4. Thread processing (if necessary):

Perform thread processing on a CNC lathe or CNC milling machine according to design requirements. Select appropriate thread tools and parameters to form threads on the inside or outside surface of the hole. 

5. Surface treatment (if necessary):

Perform necessary surface treatment such as grinding, polishing or other special treatments to improve surface quality and accuracy. 

6. Quality inspection and testing:

Use measuring tools and equipment to perform quality inspection to ensure that the processed parts meet the design specifications and dimensional tolerances. Perform visual inspection and functional testing to verify the integrity, accuracy and performance of the parts. 

Some factories will also provide partial or full assembly after processing, and then the assembled probe station components will be delivered to the customer after packaging and transportation.


How to choose a processing factory for semiconductor testing equipment parts? 

When choosing a semiconductor or semiconductor testing equipment parts processing factory, you should consider the factory's experience, advanced equipment, quality management system, delivery capabilities and service level. Communicate with the partner to understand its technical capabilities, manufacturing processes, production capacity and quality assurance to ensure that the processing needs of the parts can be met, high-quality finished products can be provided and delivered within a reasonable time.

KANOU provides one-stop production services for precision parts processing and assembly for electronic semiconductors, semiconductor testing equipment, medical equipment, and robots. Including precision CNC machining, 5-axis composite machining, turning and milling composite machining, CNC lathe machining, precision sheet metal machining, precision deep drawing and stamping machining, structure and structural parts assembly machining, etc.

If you are looking for a semiconductor testing equipment parts manufacturer, please choose KANOU! Our email: Phone: +86 188 2025 7979.


Do semiconductor testing equipment parts require high precision?

Semiconductor testing equipment parts require very high precision. Since semiconductor devices themselves have tiny sizes and high complexity, testing equipment must be able to accurately measure and analyze these subtle characteristics and performance parameters. These devices must meet the measurement needs of semiconductor components at the micron and nanometer levels.

What is the development trend of semiconductor testing equipment? 

The semiconductor testing equipment market has always been an important and growing field. With the advancement of semiconductor technology and the expansion of application areas, the demand for high-precision and high-reliability testing equipment is also increasing.

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