Electronic Semiconductor Equipment

As a specialized manufacturer of precision components for the electronic semiconductor industry, we utilize imported 5-axis, 4-axis, and 3-axis machining centers along with CNC precision engraving systems to deliver components with exceptional accuracy and reliability. Our production facilities are equipped with high-precision inspection instruments including CMMs, 2.5D optical projectors, and metal analyzers, ensuring strict compliance with industry quality standards and performance requirements.

Which materials are best suited for electronic semiconductor equipment?:

Aluminum Alloy : The preferred material for lightweight structural components and heat sinks. Offers excellent thermal conductivity (160-200 W/m·K) and corrosion resistance. Surface hardness can be enhanced through anodizing, making it suitable for wafer transfer robots, vacuum chamber supports, and other critical parts.

Stainless Steel : Ideal for core components in high-cleanliness vacuum environments. 316L stainless steel features extremely low outgassing rates (<10⁻⁹ Torr·L/s·cm²) and plasma corrosion resistance, widely used in etching machine reaction chambers, vacuum valves, and other key components.

Engineering Plastics : 

PEEK: High temperature resistance (continuous service temperature 250°C) and low outgassing properties, suitable for wafer clamps and insulating brackets requiring plasma erosion resistance.

PTFE: Stable dielectric constant (2.1±0.2) with anti-static modification capabilities, used in wafer carriers and clean pipelines for contamination prevention.

PPS: Exceptional dimensional stability (thermal expansion coefficient ≤3×10⁻⁵/°C), ideal for precision sensor brackets and moving parts.

Specialty Ceramics : Alumina/Aluminum Nitride ceramics provide ultra-high hardness (HV≥1500) and RF wave transmission properties, applied in plasma nozzles and RF feedthrough windows where wear resistance and electromagnetic compatibility are critical.

Titanium Alloy : Balances strength (tensile strength ≥895 MPa) with low thermal expansion coefficient (8.6×10⁻⁶/°C), suitable for high-precision motion modules and thermal management components to maintain dimensional stability in fluctuating temperature environments.

From now on, let KANOU Precision customize your specialized electronic semiconductor component processing solutions!

What are electronic semiconductor equipment components?

Electronic semiconductor equipment components are precision functional parts that constitute core semiconductor devices such as wafer manufacturing, packaging, and testing equipment. Their performance directly determines the accuracy, stability, and productivity of the equipment. These components must meet stringent requirements including nano-level machining precision, ultra-high cleanliness, material stability, and extreme environmental adaptability.

Core Component Categories
Transfer and Positioning Components
Wafer Handling Robots: Made of aluminum alloy/ceramic materials with repetitive positioning accuracy ≤ ±0.005mm

Precision Guides: Vacuum-coated with friction coefficient < 0.001, meeting nanoscale movement requirements for lithography machines

Reaction Chamber Components

Plasma Nozzles: High-temperature resistant ceramic materials with aperture tolerance ±0.01mm

Gas Distribution Plates: Electrolytically polished 316L stainless steel surface with roughness Ra ≤ 0.2μm

Optical and Sensing Components

Laser Alignment Mechanisms: Titanium alloy frame with thermal expansion coefficient ≤ 8.6×10⁻⁶/°C

Wafer Detection Sensors: Anti-static PEEK housing with insulation resistance > 10¹⁵Ω

Technical Characteristics
Ultra-High Precision: Dimensional tolerance up to ±0.001mm, angular deviation < 0.001°

Material Specificity: Must meet SEMI standards including low outgassing rate (<10⁻⁹ Torr·L/s·cm²) and plasma erosion resistance

Cleanliness Requirements: Produced in Class 100 clean environments with particulate contamination control < 5μm/m²

Application Scenarios
Etching Equipment: Silicon rings, gas showerheads

Deposition Equipment: Heater bases, baffle assemblies

Metrology Equipment: Probe cards, optical brackets

Packaging Equipment: Bonding heads, nozzle assemblies

Precautions for Machining Electronic Semiconductor Equipment Components

As a core component of semiconductor manufacturing systems, KANOU Precision strictly adheres to the following critical specifications for machining electronic semiconductor equipment components:

1. Material Compliance
Materials must meet SEMI standards (e.g., SEMI F47 for vacuum compatibility) with ultra-low outgassing rates (<10⁻⁹ Torr·L/s·cm²)

Components for plasma environments require high erosion resistance (e.g., alumina ceramics, anodized aluminum)

2. Precision Control
Critical feature dimensional tolerances maintained within ±0.002mm

Vacuum seal interface flatness controlled within ≤0.01mm/m²

3. Cleanliness Assurance
All components machined in Class 1000 or superior cleanrooms

Post-processing ultrasonic cleaning with semiconductor-grade solvents mandatory

4. Surface Treatment
Wafer-contact surfaces mirror-polished to Ra≤0.1μm for contamination prevention

Anodization/passivation treatments must eliminate particulate shedding

5. Contamination Prevention
Copper/zinc materials prohibited in high-voltage areas to prevent dendritic growth

Ceramic-tipped tools required for all handling operations to minimize micro-scratches

6. Traceability Requirements
Full material certifications (RoHS, REACH, SEMI) accompanying all shipments

Inspection reports including CMM and white light interferometer data provided